Important Dates

May 15, 2020

Workshop Proposal Due


August 8, 2020 (hard)

Paper Submission Deadline


September 5, 2020

Author Notification


September 27, 2020

Final Manuscript Due


November 02 – 06, 2020

Conference Date


Sponsors

Program Committee

Michele Albano, Aalborg University, Denmark

Benjamin Belzer, Washington State University, USA

Roberto Bruschi, CNIT, Italy

Cicek Cavdar, KTH Royal Institute of Technology, Sweden

Tsung-Hui Chang, The Chinese University of Hong Kong, China

JinHyeock Choi, Samsung AIT, Korea (South)

Cheng-Fu Chou, NTU, Taiwan

Ken Christensen, University of South Florida, USA

Yeh-Ching Chung, The Chinese University of Hong Kong, China

Antonio de la Oliva, Universidad Carlos III de Madrid, Spain

Luis Diez, University of Cantabria, Spain

Zheng Dong, Shandong University, China

Chao Fang, Beijing University of Technology, China

Alireza Ghasempour, ICT Faculty, USA

Javier Gozalvez, Universidad Miguel Hernandez de Elche, Spain

Fei Hao, Shaanxi Normal University, China

Chun-Hsi Huang, Southern Illinois University Carbondale, USA

Eduard Jorswieck, Technische Universität Braunschweig, Germany

Yeunghak Lee, Andong National University, Korea (South)

Laurent Lefevre, INRIA, France

Marco Listanti, University of Rome "La Sapienza", Italy

Hongbo Liu, University of Electronic Science and Technology of China, China

Behrooz Makki, Chalmers University of Technology, Sweden

Pietro Manzoni, Universitat Politècnica de València, Spain

Catalin Meirosu, Ericsson, Sweden

Francesco Musumeci, Politecnico di Milano, Italy

Tadashi Nakano, Osaka University, Japan

Adamantini Peratikou, University of Portsmouth, United Kingdom (Great Britain)

Jean-Marc Pierson, Univerty Paul Sabatier, France

Tony Q. S. Quek, Singapore University of Technology and Design, Singapore

Roberto Rojas-Cessa, New Jersey Institute of Technology, USA

Jose Santa, Technical University of Cartagena, Spain

Shunsuke Saruwatari, Osaka University, Japan

Miguel Sepulcre, Universidad Miguel Hernandez de Elche, Spain

Bo Sheng, University of Massachusetts Boston, USA

Yu Sun, University of Central Arkansas, USA

Hina Tabassum, York University, Canada

Massimo Tornatore, Politecnico di Milano, Italy

George Tsoulos, University of Peloponnese, Greece

Guodong Wang, Massachusetts College of Liberal Arts, USA

Xiaokang Wang, St. Francis Xavier University, Canada

Song Wei, North China University of Technology, China

Dapeng Wu, CQUPT, China

Jinbo Xiong, Fujian Normal Univerisity, China

Tianhua Xu, University College London, United Kingdom (Great Britain)

Changyan Yi, Nanjing University of Aeronautics and Astronautics, China

Chau Yuen, Singapore University of Technology and Design, Singapore

Sherali Zeadally, University of Kentucky, USA

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